Date:				2026-02-03
Name:				TMC5222-EVAL_V10

Layers:				4 (HDI)
PCB Width:			55 mm
PCB Height:			85 mm
PCB Thickness:			1.2 mm

Outer Layer Copper:		35 m (end)
Inner Layer Copper:		35 m

Silk Screen Top:		required (black)
Silk Screen Bottom:		required (black)
Solder Mask Top:		white
Solder Mask Bottom:		white
Surface finish: 		ENIG

Microvias:			Blind microvias (L1 to L2) shall be filled and capped (IPC-4761 Type VII)
Tented vias:			All vias with a hole diameter of 0.3 mm shall be filled and covered with soldermask (IPC-4761 Type VI B).

Smallest copper clearance: 	100 m
Smallest trace width: 		200 m

Manufacturing of PCB:		must be compliant to the latest revision of IPC-6012, Class 2.
Assembly:			must be compliant to IPC-A-610 Class 2.

UL logo:			required 